OVERVIEWThe Model 865 is a high precision semiautomatic flip chip die bonder which is ideal for use at universities, for research and development and for low volume production.KEY BENEFITS High precision Servo driven closed loop system with load protection Bond loads from 10g to 10Kg Quick setup Easy to use Versatile R & D oriented,…
https://www.semicorp.com/wp-content/uploads/2020/02/Model_850.mp4 OVERVIEW Semiconductor Equipment Corporation´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up…
